The Reballing process consists of: Disassembling the equipment in its entirety, making use of the REWORK equipment and a tin accelerator of the best quality, the preheating process is carried out and the temperature curve is used to gut chip (Nvidia, ATI, Intel ...) Using a soldering station, excess tin is removed both on the video chip and on the board, left by the molten spheres. Using the base and the specific stencil (for ATI, Nvidia, Intel ...), the tin spheres are aligned and subsequently melted. Again we use the REWORK equipment to position the chip (Nvidia, ATI, Intel ...) and through the curves At the appropriate temperature, the chip is fixed on the form. After the plate has cooled down, the plate is cleaned using ultrasound equipment and a cleaning liquid to remove all particles and substances left behind. in the REBALLING process. Subsequently, it is necessary to use dry air under pressure to remove any residual moisture.